Key Points
Overview
Advanced packaging is becoming the cornerstone of AI semiconductor scaling as Moore’s Law slows and the cost of advanced nodes continues to rise. No longer a back-end cost center, 2.5D/3D packaging has evolved into a primary driver of performance-per-watt, bandwidth density, and system-level efficiency. From EDA tools such as Synopsys 3DIC Compiler and Cadence Integrity 3D-IC to foundry leaders such as TSMC, Samsung, and Intel, and OSATs such as ASE and Amkor, the entire value chain is converging to deliver increasingly complex and capable packaging solutions for AI workloads.