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Memory & Storage

HBM, DRAM, NAND, and storage technology coverage.

The Hidden Moat: Why Operational Depth Defeats the 'Build It Yourself' Narrative
Analysis

The Hidden Moat: Why Operational Depth Defeats the ‘Build It Yourself’ Narrative

Operational Depth in Enterprise SaaS: The Hidden Moat Against the ‘Build It Yourself’ Narrative. Core value is in governance, security, and deep orchestration.

Keith Kirkpatrick · Jun 4, 2026 · 14 min

Will Adobe and NVIDIA's RTX Spark Partnership Redefine Creative AI Workflows?
Analysis

Will Adobe and NVIDIA’s RTX Spark Partnership Redefine Creative AI Workflows?

NVIDIA’s RTX Spark partnership with Adobe accelerates creative AI workflows, delivering 2x faster performance in Photoshop, Premiere, and more.

Keith Kirkpatrick · Jun 2, 2026 · 5 min

Broadcom Lays the Pipeline for the Intelligent Edge With 50G PON and Wi-Fi 8 at COMPUTEX 2026
Analysis

Broadcom Lays the Pipeline for the Intelligent Edge With 50G PON and Wi-Fi 8 at COMPUTEX 2026

Broadcom’s broadband Edge AI portfolio pairs 50G PON and Wi-Fi 8 with on-chip NPUs, advancing an intelligent edge where connectivity gates the AI home.

Brendan Burke · Jun 2, 2026 · 6 min

NVIDIA Engineers the Agentic Data Center with DSX Software Control and Vera CPU Acceleration
Analysis

NVIDIA Engineers the Agentic Data Center with DSX Software Control and Vera CPU Acceleration

NVIDIA launches Vera CPU and DSX software to engineer the agentic data center, shifting AI factory competition from chip performance to software-controlled tokens per megawatt.

Brendan Burke · Jun 2, 2026 · 6 min

AMD Launches New CPUs With DDR4 Support
Featured

AMD Launches New CPUs With DDR4 Support

CPU and motherboard makers like to transition off of old […]

Andy Patrizio · Jun 1, 2026 · 3 min

Samsung, SK Hynix and Micron Commence DDR6 Development - Techstrong IT
Featured

Samsung, SK Hynix and Micron Commence DDR6 Development

DDR5 memory is still impossible to get, but the major DRAM manufacturers have begun work on DDR6.According to the Korean publication The Elec, substrate manufacturers have been requested by the top three memory makers, Samsung, SK Hynix, and Micron, to advance the development of DDR6.Package substrates in DRAM matter

Andy Patrizio · May 5, 2026 · 1 min

Who Really Wins from the Flash Price Surge?  - Techstrong IT
Featured

Who Really Wins from the Flash Price Surge?

In a data-driven economy, infrastructure costs are no longer a back-office concern. They shape how capital is deployed, how fast companies can scale, and how exposed they are to supply-chain volatility. Storage sits at the center of that equation, even if most business leaders only notice it when something breaks or becomes

Gal Naor · Apr 2, 2026 · 4 min

Can AMD Strengthen Both Logic and Memory Supply Chains With Samsung?
Analysis

Can AMD Strengthen Both Logic and Memory Supply Chains With Samsung?

Samsung AMD AI memory collaboration highlights HBM4 supply, DDR5 integration, and growing memory constraints shaping AI infrastructure.

Brendan Burke · Mar 30, 2026 · 5 min

AI Demand Drives Prolonged Crunch in Global Memory Chip Supply - Techstrong IT
Featured

AI Demand Drives Prolonged Crunch in Global Memory Chip Supply

The tech sector has been grappling with the challenges of a memory chip shortage with the expectation that it will be relatively short-lived. Now it appears that supply constraints could persist for much of the decade, raising costs and complicating the rollout of next-gen AI systems. According to industry estimates,

James Maguire · Mar 18, 2026 · 2 min

Intel Unveils Chip That Processes Encrypted Data at Accelerated Speed - Techstrong IT
Featured

Intel Unveils Chip That Processes Encrypted Data at Accelerated Speed

Intel has introduced a specialized processor designed to dramatically accelerate one of the most challenging tasks in cybersecurity: computing directly on encrypted information. The prototype chip, called Heracles, is engineered to perform fully homomorphic encryption (FHE) calculations thousands of times faster than conventional server processors. FHE allows computers to process data without ever decrypting it, meaning

James Maguire · Mar 11, 2026 · 3 min

Applied Materials Q1 FY2026: AI Demand Lifts Outlook Across Logic, HBM, and Packaging
Analysis

Applied Materials Q1 FY2026: AI Demand Lifts Outlook Across Logic, HBM, and Packaging

Applied Materials delivered strong Q1 results fueled by AI computing investment. Management expects Semiconductor Systems business to grow more than 20% in calendar 2026.

Brendan Burke · Feb 17, 2026 · 1 min

At CES, NVIDIA and AMD Made Memory the Future of AI
AI Silicon

At CES, NVIDIA and AMD Made Memory the Future of AI

NVIDIA unveiled Vera Rubin and AMD introduced Helios at CES 2026. Both demonstrate readiness for production, highlighting memory and power bottlenecks in AI infrastructure.

Brendan Burke · Jan 12, 2026 · 1 min

Unpacking Advanced Packaging for AI Semiconductors: CoWoS, CPO, CoPoS, and SoW-X
Memory & Storage

Unpacking Advanced Packaging for AI Semiconductors: CoWoS, CPO, CoPoS, and SoW-X

Strategic advisory examining how 2.5D/3D integration, CoWoS, Co-Packaged Optics, CoPoS, and SoW-X will drive performance and efficiency gains for AI hardware through the late 2020s.

Brendan Burke · Aug 27, 2025 · 3 min