Fab Equipment
Anthropic Files For IPO, Looking to Beat OpenAI to the Punch
Anthropic confidentially files for IPO after $965B Series H. What does the financial data tell us ahead of a potential October 2026 listing?
Nick Patience · Jun 2, 2026 · 6 min
Intel Xeon 6+ Targets Agentic AI Density With 288 E-Cores on Intel 18A
Intel Xeon 6+ on Intel 18A with Foveros Direct 3D delivers 288 cores for agentic AI, leveraging captive fabs as a structural supply advantage.
Brendan Burke · Jun 2, 2026 · 9 min
Can NVIDIA’s RTX Spark Make Home AI a Relief Valve for the Grid?
NVIDIA RTX Spark moves AI agents on-device and could relieve a strained grid, but memory bandwidth and software gaps will set the real limits.
Brendan Burke · Jun 2, 2026 · 7 min
Escape Velocity — When Does China’s AI Stack Break Free?
When does China’s AI stack reach escape velocity? A vector-by-vector reading of Futurum’s 1H 2026 silicon model against Jensen Huang’s Dwarkesh interview.
Erik Bethke · Jun 1, 2026 · 19 min
Marvell Q1 FY 2027 Raises Full-Year Outlook on AI Data Center Demand
Marvell Q1 FY 2027 earnings show AI data center demand driving interconnect, switching, and custom silicon outlook into FY 2028.
Brendan Burke · Jun 1, 2026 · 5 min
Mistral AI Shifts to Full-Stack Strategy With Vibe and Industrial AI
Mistral AI agent platform takes shape at AI Now Summit: Vibe unifies work and code agents, industrial AI targets aerospace and automotive, and Les Ulis adds inference capacity.
Nick Patience · Jun 1, 2026 · 8 min
Teradyne Q4 FY 2025 Shifts the Narrative to Data Center and Physical AI
Teradyne AI testing and robotics drive Q4 2025 results. AI demand fueled 60% of revenue as testing and physical AI robotics hit new peaks.
Brendan Burke · May 29, 2026 · 4 min
Can Google and Samsung Displace Meta in the Smart Glasses Segment?
Google’s intelligent eyewear brings Gemini-powered smart glasses back into focus, but privacy and adoption risks remain unresolved.
Olivier Blanchard · May 29, 2026 · 8 min
Applied Materials’ EPIC Advanced Packaging Ecosystem Adds Broadcom to TSMC
Broadcom partners with Applied Materials to accelerate next-generation AI chip development through co-innovation
Brendan Burke · May 28, 2026 · 6 min
Intel Charges Ahead With New Process Nodes
Intel may have finally gotten its 18A process node right, but it’s sure not resting on its laurels. The company CEO has announced two new process shrinks in the coming years.Intel’s leading edge process technology is currently at 18A, or 1.8 nanometers, and 14A is in the works. CEO Lip-Bu Tan
Andy Patrizio · May 23, 2026 · 2 min
TSMC Lays Out ‘Three-Layer Cake’ Vision for AI Chips
Taiwan Semiconductor Manufacturing Company (TSMC) is laying out a vision for the future of chip design that is built on a platform of three integrated technologies rather than keeping them separate.The new paradigm was introduced at the 2026 Technology Symposium in Hsinchu, Taiwan, by TSMC Senior Vice President Zhang Xiaoqiang. The
Andy Patrizio · May 20, 2026 · 2 min
Applied Materials Q2 FY 2026: AI Capacity Expansion Fuels Equipment Demand
Applied Materials Q2 FY 2026 results beat consensus, raised equipment growth expectations, and AI-led demand in logic, DRAM, and packaging.
Brendan Burke · May 18, 2026 · 5 min
Applied Materials and TSMC Partner to Drive Semiconductor R&D Roadmap
Applied Materials partners with TSMC to accelerate semiconductor R&D for AI scaling and next-generation chip manufacturing technologies.
Brendan Burke · May 11, 2026 · 5 min
Applied Materials Targets $3.5 Billion Electrochemical Deposition Market With NEXX Acquisition
Applied Materials acquires NEXX to add electrochemical deposition for panel-level AI chip packaging, expanding its packaging portfolio.
Brendan Burke · May 7, 2026 · 6 min
Teradyne Q1 FY 2026 Earnings Credit Revenue Growth to AI Test Demand
Teradyne Q1 FY 2026 earnings show AI-led test demand and early merchant GPU progress, while Q2 guidance implies timing volatility.
Brendan Burke · May 7, 2026 · 4 min
TSMC to Invest $56B in Fabs This Year, and It’s Still Not Enough
Taiwan Semiconductor Manufacturing Company (TSMC) said it plans to spend between $52 and $56 billion in capital expenditures this year, but it expects the parts shortage to remain through 2027.The comments were made by Jen-Chau Huang, senior VP & CFO, on a conference call with financial analysts to discuss TSMC’s first
Andy Patrizio · May 1, 2026 · 2 min
Applied Materials Arms Chipmakers for the GAA Era With Angstrom-Class Tools
Applied Materials targets GAA transistor fabrication at 2nm and beyond with two new deposition systems, signaling a materials-first era.
Brendan Burke · Apr 9, 2026 · 6 min
Musk’s Terafab Gains Momentum as Intel Brings Chip Expertise
Intel has partnered with Elon Musk’s Terafab initiative, a proposed semiconductor effort that aims to support the expanding compute demands of AI and robotics. The agreement joins Intel with Musk-led ventures Tesla, SpaceX, and xAI in an ambitious attempt to reconfigure how advanced chips are produced in the US. The initiative plans to build out large-scale
James Maguire · Apr 8, 2026 · 3 min
Will Applied Materials’ Transistor Breakthroughs Empower 2nm AI Chips?
Applied Materials launches new systems — Viva radical treatment, Sym3 Z Magnum etch, and Spectral ALD molybdenum contacts — that address the limitations of Gate-All-Around transistors at 2nm, unlocking energy-efficient AI silicon at scale.
Brendan Burke · Feb 11, 2026 · 5 min